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DTSTART:20250122T110000Z
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TRANSP:OPAQUE
DTEND:20250122T120000Z
LOCATION:Seminar Room
SUMMARY:ICFO | TOLGA TEKIN 
CLASS:PUBLIC
DESCRIPTION:ABSTRACT:\nA major hurdle in developing next-generation systems
  for high-performance applications and industries that require handling la
 rge\, secure data - such as System-in-Package (SiP) and System-on-Chip (So
 C) - is the absence of low-latency\, high-bandwidth\, and high-density off
 -chip/chiplet/core interconnects. Achieving high-bandwidth chip-to-chip (o
 r chiplet-to-chiplet) communication using electrical interconnects faces c
 hallenges like high substrate dielectric losses\, reflections\, impedance 
 discontinuities\, and susceptibility to crosstalk. This underscores the mo
 tivation to adopt photonics to address these challenges and enable low-lat
 ency\, high-bandwidth communication. The objective is to develop a CMOS-co
 mpatible technology to support the next-generation photonic layer within 3
 D SiP/SoC\, moving towards converged microsystems.\nBIO:\nTolga Tekin has 
 received the Ph.D. degree in electrical engineering and computer science f
 rom the Technical University of Berlin\, in 2004. He was a Research Scient
 ist with the Optical Signal Processing Department\, Fraunhofer HHI\, where
  he was engaged in advanced research on optical signal processing\, 3R-reg
 eneration\, all-optical switching\, clock recovery\, and integrated optics
 . He was a Postdoctoral Researcher on components for O-CDMA and terabit ro
 uters with the University of California. He worked at Teles AG on phased-a
 rray antennas and their components for skyDSL. At the Fraunhofer Institute
  for Reliability and Microintegration (IZM)\, he then led projects on opti
 cal interconnects and silicon photonics packaging. At the Technical Univer
 sity of Berlin\, he then engaged in microsystems\, photonic integrated sys
 tem-in-package\, photonic interconnects\, and 3-D heterogeneous integratio
 n research activities.\nHe is Manager of Photonics and Plasmonic Systems G
 roup at Fraunhofer IZM. His R&amp\;D activities cover heterogeneous integr
 ation\, photonics interconnects\, and optical-wireless networks. He coordi
 nated the European Flagship project 'PhoxTroT'\, 'L3MATRIX'\, and 'MASSTAR
 T'\, and is currently coordinating the Horizon Europe Flagship project 'AL
 LEGRO'.
DTSTAMP:20260405T001709Z
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