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VERSION:2.0
PRODID:Icfo
X-PUBLISHED-TTL:P1W
BEGIN:VEVENT
UID:69da7e0ed3aef
DTSTART:20260422T100000Z
SEQUENCE:0
TRANSP:OPAQUE
DTEND:20260422T110000Z
LOCATION:Elements Room
SUMMARY:ICFO | PALOMA MACHAIN
CLASS:PUBLIC
DESCRIPTION:The development of qubits has largely been guided by the requir
 ements of fault-tolerant\, gate-based quantum computing and\, more recentl
 y\, by topological quantum computing paradigms. These approaches impose ex
 ceptionally stringent constraints on materials quality\, coherence times\,
  and device uniformity\, often requiring complex materials stacks\, bespok
 e fabrication processes\, and long technology maturation cycles. In contra
 st\, quantum analog computing operates in a distinct regime in which scala
 bility\, reproducibility\, and integration density take precedence over ul
 tra-high coherence\, enabling alternative materials and fabrication strate
 gies.\nThis invited talk presents a materials-centric perspective on the r
 ealization of superconducting qubits for quantum analog computing\, emphas
 izing the advantages of leveraging mature superconducting materials system
 s and CMOS-compatible microfabrication technologies. The use of well-estab
 lished thin-film superconductors\, conventional Josephson junction process
 es\, and industrial process control enables high fabrication yield\, impro
 ved parameter uniformity\, and vertical integration across the hardware st
 ack. These characteristics are essential for scaling quantum analog proces
 sors to large qubit counts while maintaining manageable complexity\, cost\
 , and development timelines.\nKey materials challenges defining the perfor
 mance envelope of quantum analog hardware will be discussed\, including su
 perconducting film uniformity\, interface and dielectric losses\, junction
  reproducibility\, wiring density\, and three-dimensional integration cons
 traints. These challenges are contrasted with those encountered in fault-t
 olerant digital and topological quantum computing\, illustrating how diffe
 ring system-level requirements lead to fundamentally different materials b
 ottlenecks and fabrication trade-offs. Rather than treating these paradigm
 s as competing approaches\, this perspective frames them as complementary 
 stages within a broader superconducting quantum technology roadmap.&nbsp\;
DTSTAMP:20260411T165958Z
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