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UID:6ae6c6867cdb8
DTSTART:20261118T110000Z
SEQUENCE:0
TRANSP:OPAQUE
DTEND:20261118T120000Z
LOCATION:Seminar Room
SUMMARY:ICFO | ALEJANDRO MARTÍN RODRÍGUEZ
CLASS:PUBLIC
DESCRIPTION:Since the first isolation of graphene\, the fabrication of 2D m
 aterials has evolved enormously. Today\, many different 2D materials can b
 e combined to create&nbsp\;heterostructures with different properties from
  their constituent materials. Additionally\, we&nbsp\;can set the twist an
 gle between layers with sub-degree precision\, to create novel materials s
 uch as magic-angle twisted graphene.&nbsp\;\nWhen performing scanning tunn
 eling microscopy (STM) on 2D materials\, there is an additional constrain:
  the surface of the active material must remain exposed and atomically cle
 an. As STM probes the topmost atomic layer of the sample\, it is extremely
  sensitive to any contamination left on the surface. This is a real challe
 nge\, because standard nanofabrication processes rely on polymers and solv
 ents whose residues are hard to remove from 2D materials.&nbsp\;\nIn this 
 seminar\, I will present the fabrication techniques we have developed and 
 implemented in our group to obtain clean open-surface 2D heterostructures\
 , and walk you through our workflow towards a fully functional sample. The
  process has three main steps. First\, we perform the dry transfer process
 \, by which the different 2D materials are assembled into a single heteros
 tructure. Second\, we need a step which ensures our topmost surface is cle
 an. For this purpose\, we have two different methods\, which we call the f
 lip and the hBN sliding. Finally\, the layers are electrically contacted w
 ithout exposing the sample to any lithographic process. During the talk\, 
 I will guide you through all these steps&nbsp\;emphasizing the critical de
 tails of the process.&nbsp\;\nAlong the way\, the workflow relies on sever
 al nanofabrication protocols\, including SU-8 lithography\, KOH wet etchin
 g\, evaporation\, PDMS casting and dry transfer. I will explain how they w
 ork and how we have implemented them at ICFO.&nbsp\;
DTSTAMP:20261101T045638Z
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